Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD14.99
USD42.99

Pay in 4 interest-free payments of $3.75 Learn more

Field rating
4.1

Verified studio score · Spec revision current

Fit · Size

JTX JP-1 Universal Preheater for Phone PCB Layering Glue Removal Model:JTX JP-1 Preheater iBooter Standard with JCID Drawing

SKU: 53935576362

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 23 - Aug 28

Description

iBooter Standard with JCID Drawing 2 Years: iBooter + 1x 4-in-1 HUB boot cable + iPhone 12-14 Pro Max FPC cable(8pcs) + JCID Drawing 2 years account

11 AC wireless communication protocol

Both ODM and OEM accept

SM-N960U (TMB)

Suitable For Rapid Cooling And Effective Dust Removal

JTX JP-1 Universal Preheater for Phone PCB Layering Glue Removal Model:JTX JP-1 Preheater iBooter Standard with JCID DrawingJTX JP 1 300W Universal Preheating Platform for mobile phone iPhone motherboard layering, lamination, reballing tinning, and glue removal repair. JTX JP 1 heating station is suitable for mobile phone PCB repair, circuit board CPU chip reballing, BGA chip and FPC connector socket and other precision parts disassembly and assembly. Features: 1. Universal heating platform is suitable for mobile phone motherboard layering, lamination, tinning, and glue

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

You may also like

recommand products